The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the electronic packaging, chip packaging, photovoltaic cell chip packaging, special engineering plastic products, inks, paints, pigments, daily chemical products and so on.

SiO₂ Purity: 99.95% min.

Size: D50, 1-10um per the user's demands.

ITEM	UNIT	SSP - 10	SSP- 7	SSP- 4	SSP – 2.5	SSP- 1
Size: D50	µm	10±2	7.0±1	4.0±1	2.5±0.5	1.0±0.5
Size: Dmax		45	30	15	10	5
SiO2 content	%	99.95	99.95	99.95	99.95	99.95
H2O content		0.05	0.05	0.05	0.05	0.05
percent of spheroidization		>98	>98	>98	>98	>98
Specific surface area	M2g-1	1.0	1.5	1.7	1.9	9.0
Na	ppm	<10	<10	<10	<10	<10
K		<2	<2	<2	<2	<2
Ca		<3	<3	<3	<3	<3
Mg		<1	<1	<1	<1	<1
Al		<50	<50	<50	<50	<50
Fe		<10	<10	<10	<10	<10
Ti		<10	<10	<10	<10	<10
As		<1	<1	<1	<1	<1
P		<1	<1	<1	<1	<1
Cr		<1	<1	<1	<1	<1
Mn		<1	<1	<1	<1	<1
Ni		<1	<1	<1	<1	<1
Cu		<1	<1	<1	<1	<1
Mo		<1	<1	<1	<1	<1
U	ppb	<0.3	<0.3	<0.3	<0.3	<0.3

Packing by brown paper drum with 25kg net per drum (25Kg/Drum) or 25Kg net per pp bag within plastic inner bag.